Wafer Cutting Machine

Material and Parameters

Frame: GB steel
Wafer Contact parts are made of 304 stainless steel
Motor: SEW
Encorder: Schneider
Power: 0.75 Kw
Cutting style: cutting wire or cutting knife (optional)
Cutting speed: 15 book/min
Dimension: 1545 x 2100 x 1100 (mm)

Description

Cutting machine adopts PLC program control automation and goes well with cutting conveyors. Easy to change cutting wire/knife. The cutting layer is optional and adjustable. Cutting channel using organic glass shield as safety protection.

Wafer Distribute Machine

The device is for distributing cut wafer bars and feeding a downstream chocolate plant or packing conveyor. The second cut pushes the cut wafer bars through the distribution rails and singles them.

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